Tianya Wu - Overview of pixel chip for CEPC Vertex Detector

Wednesday 5 Jun 2019, 13:00 → 14:00 Europe/Madrid

Seminar (IFAE)

Marc Manera (IFAE), Pere Masjuan (IFAE), Stefano Terzo (IFAE)

The Circular Electron-Positron Collider (CEPC) is proposed for high-precision measurements of the Higgs boson. It will include a vertex detector designed to provide an excellent impact parameter resolution. Monolithic Active Pixel Sensors (MAPS) are being investigated for the CEPC vertex detector due to its high granularity, high speed, low material budget, low power consumption and radiation tolerance. According to the preliminary estimation, radiation hardness requirements will be of ~1MRad/year and 2×1012 1MeVneq/cm2/year for Total Ionizing Dose (TID) and Non-Ionizing Energy Loss (NIEL) respectively. The previous MOST1 project resulted in the first prototype of 25×25μm2 pixels was produced with a 0.18um CIS process from TowerJazz. However, the analogue peaking time (1μs) and integration readout time (100μs) of the MOST1 did not meet the requirement. In order to overcome those limitations, the MOST2 was launched in 2018. The first prototype with a pixel matrix of 192×64 has been submitted to fabrication in June 2019 and it is presented in this seminar.