Short minutes and plans:
- briefly discussed the situation of the project. Work on going on device bump-bonding and testing towards assembly of final camera.
Plans:
1- Plan to assemble 2 new devices and possible rework one (Mokhtar)
2- Prepare software/DAQ to extract information about bump-bonding of devices (Oscar)
3- Prepare as many as possible baby-pcbs and order part to mount all (18) (Jorge/Eric)
4- Adrian: continue work on external pulse equalization