RIS3CAT meeting

Europe/Madrid

Short minutes and plans:

- briefly discussed the situation of the project. Work on going on device bump-bonding and testing towards assembly of final camera.

Plans:

1- Plan to assemble 2 new devices and possible rework one (Mokhtar)

2- Prepare software/DAQ to extract information about bump-bonding of devices (Oscar)

3- Prepare as many as possible baby-pcbs and order part to mount all (18) (Jorge/Eric)

4- Adrian: continue work on external pulse equalization

 

 

 

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